세미나

Dynamic assembly of conducting nanomaterials in polymer

 

Jiheong Kang (강지형 교수)

 

¹ Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Korea

*E-mail : jiheongkang@kaist.ac.kr

 

In this presentation, I will first show my approaches to designing mechanically tough yet dynamic polymer networks to use for soft electronics. Designed materials realize exceptional mechanical properties such as notch-insensitive high stretchability, high toughness of 12,000 J/m², and autonomous self-healing even in aquatic environments. Second, I will talk about the new class of assembly methods of various conducting materials (Conducting polymer, Liquid metal droplets, Nanowires…) inside polymer matrices and their exceptional properties. With our approaches, we could develop tissue-like hydrogel interface material and strain-insensitive conductive material. Finally, I will share their new opportunities with the details for soft electronics.

 

(1) Kang, J.^†: Son, D.^†; Wang, G.J.N; Liu, Y.; Lopez, J.; Kim, Y.; Oh, J.H.; Kasumata, T.; Mun, J.; Lee, Y.; Jin, L.; Tok, J.B.; Bao, Z. “Tough and Water-Insensitive Self-Healing Elastomer for Robust Electronic Skin,” Advanced Materials 2018, 30 (13), 1706846 (Highlighted in Advanced Science News)

(2) Son, D.^†; Kang, J.^†; Vardoulis, O.^†; Kim, Y.; Matsuhisa, N.; Oh, J-Y.; To, J. W. F.; Mun, J.; Katsumata, T.; Liu, Y.; McGuire, A.; Krason, K.; Ham, J.; Kraft, U.; Lee, Y.; Lee, Y.; Tok, J.B.; Bao, Z. “An Integrated Self-healable Electronic Skin System Fabricated Via Dynamic Reconstruction of a Nanostructured Conducting Network,” Nature Nanotechnologies 2018, 13 (11), 1057

(3) Chong, J. ^†; Sung, C. ^†; Nam, K.; Kang, T.: Park, H.; Kim, H.; Park, S.*; Kang, J* “Adhesive-free hydrogel bioelectronics enabled by a template directed assembly of metallic tough hydrogel” Nature Communication, Under revision

(4) Lee, W^†.; Kim. H^†.; Kang. I.; Park, H.; Jung, J; Lee, H; Park, H.; Ryu, S.; Jeong, J-W.; Kang, J* “Universal assembly of liquid metal particles in polymers enables elastic printed circuit board” Science, 2022, 378, 637 (Highlighted by Science ‘Perspective’)

(5) Kang. J.; J. Mun.; Zheng, Y.; Koizumi, M.; Matsuhisa, N.; Wu, HC.; Chen, S.; Tok, J.B.-H.; Lee, G.H.; Jin, L.; Bao, Z.; “ Tough-interface enabled stretchable polymer electronics using non-stretchable conductors and semiconductors” Nature Nanotechnology 2022, 17, 1256